THERMINIC goes from strength to strength!

More than 140 scientists from around the world met in Stockholm from September 26-28, 2018 for the 24th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC 2018), making it, again, the largest THERMINIC Workshop in recent history. As usual, the workshop offered a strong scientific program with 3 keynotes, 48 oral and 14 poster presentations organized in 14 oral sessions and two poster introduction sessions.

A real highlight was the international character of the conference and the representation of all stakeholders in the area of thermal issues in electronic components. 23 different countries were represented, leading to new synergies that gave the conference floor networking and social program an extra buzz, with everyone leaving the conference with new enthusiasm, inspiration and contacts.

The conference dinner on Thursday evening was another true highlight, taking the participants to the Vasa Museum, where after a short guided tour around the museum they dined right next to the world’s only preserved 17th century ship.

Our congratulations go to the winners of the Best Paper Award (Fabian Koenemann from IBM Research et al. for their paper on “Nanoscale Scanning Probe Thermometry”) and Best Poster Award (Torsten Nowak and his colleagues from the Brandenburg University of Technology, Germany, for their work on “Numerical Study with Experimental Validation of Thermal Coupling Phenomena with Flip-Chip Assembled Test Dies on PCB”) – well done, everybody!

The organizers would like to thank our keynote speakers and all speakers, poster presenters, session chairs and sponsors for the part they played in this truly memorable event.

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Therminic 2019

25th INTERNATIONAL WORKSHOPThermal Investigations of ICs and Systems25 – 27 September 2019 | LECCO